Masaru Oomi , Toshiro Fukumoto , Takao Kobayashi , Masa遊雅堂 オッズbu Sugiura , Katsuo Nakayama , Ken'ichi Namba
Ab遊雅堂 オッズract
In recent years, the heat produced in notebook PCs has increased rapidly along with the upgraded speed of the MPU, making heat dissipation measures thereof indispensable. Micro heat-pipe heat-sinks which are capable of dealing with this problem have been in practical use since 1995. Conventional heat-sinks, however, can no longer provide sufficient cooling for the late遊雅堂 オッズ version of MPUs in notebook PCs where increased heat production is seen caused by high-performance peripheral components. This paper reports on the technological background of micro heat-pipe heat-sinks for notebook PCs together with fin-composite micro heat-pipe heat-sinks that are expected to dominate the field of heat-sinks of the next generation.
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