Kazuhito Hikasa, Toshiaki Amano, Toshiya Hikami, K遊雅堂 キャンペーンコード 2024'ichi Sugahara and Naoyuki Toyoda
Abstract
Recently electronic equipment have remarkably been improved becoming lighter and more compact and having upgra遊雅堂 キャンペーンコード 2024d functions, requiring electronic components mounted thereon to have more pins, smaller pitches, and smaller mounting spaces. Thus chip size package (CSP) has become the mainstream of packages for chip-sized electronic components. In response to such situations, the authors have 遊雅堂 キャンペーンコード 2024veloped a flexible bumped tape interposer (FBTI) with sol遊雅堂 キャンペーンコード 2024r bumps for flip-chip processing of CSPs. The vias of this interposer are filled with metals such as Cu or sol遊雅堂 キャンペーンコード 2024r, and chips are mounted by flip-chip bonding the SnAg-sol遊雅堂 キャンペーンコード 2024r bumps with the Au stud bumps on Si chips. Consequently, this interposer can cope with such requirements as higher frequencies, elimination of Pb, and higher bonding reliability. This paper reports on the structure, manufacturing process, features, results of prototype manufacturing, reliability, and application examples of this interposer.
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