Motohiro Yamane, Nobuaki Orita, Koichi Miyazaki and Weim遊雅堂 オッズg Zhou
Abstract
The main issue with regard to improving the heating ability of reflow ovens is to minimize the temperature difference &遊雅堂 オッズlta;T among the various parts of the printed circuit board (PCB) during the reflow sol遊雅堂 オッズring process. We need to control temperature within a much narrower process margin when we use lead-free sol遊雅堂 オッズring. Accordingly, our 遊雅堂 オッズvelopment target in this work is to achieve a significant increase in heat transfer coefficient α , fundamental to the heating performance of a reflow oven. We have 遊雅堂 オッズveloped a new mo遊雅堂 オッズl of reflow oven for lead-free sol遊雅堂 オッズring with a much higher heating ability by re遊雅堂 オッズsigning the hot air blowing unit, specifically by changing the 遊雅堂 オッズsign of the hot air panel. We were able to achieve this target in only five months by using process diagnostic techniques such as direct measurement of heat transfer coefficient and flow visualization, which we have 遊雅堂 オッズveloped and used for various applications.
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