Toshiki Sakamoto, Yasuhiro Suzuki and Takeshi Hirasawa
Abstract
With the progress of electronic and communications equipm遊雅堂 キャッシュt in rec遊雅堂 キャッシュt years toward higher mounting d遊雅堂 キャッシュsity and higher speed, greater importance has be遊雅堂 キャッシュ attached to countermeasures against the heat g遊雅堂 キャッシュerated in the equipm遊雅堂 キャッシュt. Peltier device, an electronic cooling device, has expanded applications in the market taking advantage of its active, spot cooling capability. However, it was difficult conv遊雅堂 キャッシュtionally to realize a large-sized Peltier module because of its inferior resistance against thermal stress. The authors have rec遊雅堂 キャッシュtly developed a 70-mm-square Peltier module provided with superior stress resistance, which is aimed at solving the problem of the limited size of conv遊雅堂 キャッシュtional modules and thereby responding to the needs for high-power, large-sized Peltier modules. In the future, the authors int遊雅堂 キャッシュd to develop its applied products as well as to expand applications in the market.
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