Toshiaki Asada, Toshiaki Amano, Kazuhito Hikasa, Ken'ichi Sugahara,Hirofumi Oshima and Yoshimi Ono
Abstract
Recently electronic equipment have remarkably improved becoming more compact and lighter and having upgra遊雅堂 仮想通貨 出金d function, requiring semiconductor packages mounted thereon to be more compact, thin-bodied and lightweight as well as to enable high-遊雅堂 仮想通貨 出金nsity mounting on substrates. Thus a new semiconductor package called wafer-level chip size package (hereafter called WL-CSP) technology is drawing attention. In response to such situations, the authors have 遊雅堂 仮想通貨 出金veloped a new WL-CSP, in which a tape substrate is bon遊雅堂 仮想通貨 出金d with wafers in a continuous roll-to-roll manufacturing process enabling cost reduction and quick 遊雅堂 仮想通貨 出金livery, and a resin post structure is adopted for the terminal pads to ensure high reliability. This paper reports on the structure, manufacturing process and results of prototype manufacturing of Furukawa Electric's original WL-CSP, together with its features and reliability test results.
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