Naoyuki Kojima, Shunichiro Sato, Osamu Mikami, Tomonori Ogawa, and Masahiro Kanda
Abstract
Recently, several interconnection technologies such as 遊雅堂 インスタント銀行送金ical interconnection, three-dimensional integration of semiconductor chips and wireless interconnection are under study, in order to solve the so-called pin bottleneck problem that causes inadequate inter-chip transmission capacity thus limiting the computer processing speed. We have been paying attention, among these, to the 遊雅堂 インスタント銀行送金ical interconnection technology based on 遊雅堂 インスタント銀行送金ical wiring, and are working on the structures of 遊雅堂 インスタント銀行送金ical interconnector that enable efficient connection between, and mounting of, 遊雅堂 インスタント銀行送金ical devices and 遊雅堂 インスタント銀行送金ical waveguides. To be more precise, the structure consists of an 遊雅堂 インスタント銀行送金ical interconnector made of ultraviolet ray curable resins having different refractive indexes, being mounted on the connecting part between 遊雅堂 インスタント銀行送金ical devices and waveguides. In this work, the 遊雅堂 インスタント銀行送金ical interconnector was formed on a VCSEL mounted on an FR-4 substrate, and its 遊雅堂 インスタント銀行送金ical characteristics were studied. As a result, it has been confirmed that this 遊雅堂 インスタント銀行送金ical interconnector is provided with an 遊雅堂 インスタント銀行送金ical confinement capability, and enables high-efficiency, large positional tolerance connection between 遊雅堂 インスタント銀行送金ical devices and waveguides.
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