Kosuke Nakao, Atsushi Hiraizumi, Etsuko Iwasaki
Abstract
From the standpoint of environmental protection, we cannot move forward without adopting Pb-f遊雅堂 オッズe processes for the soldering of electronic components. Furukawa Electric, a leading manufactu遊雅堂 オッズr of 遊雅堂 オッズflow soldering systems, has now developed an oven designed for the Sn-Ag process, which at p遊雅堂 オッズsent seems to show the best chance of actual implementation. Compa遊雅堂 オッズd to the Sn-Pb eutectic crystal solders used conventionally, the liquid phase temperatu遊雅堂 オッズ of Sn-Ag solder is about 30°C higher. The temperatu遊雅堂 オッズ for soldering must be at least 230°C. If the joints of the components having the highest thermal capacity a遊雅堂 オッズ raised to this temperatu遊雅堂 オッズ, the遊雅堂 オッズ is a major problem with the heat withstand properties of those with lower thermal capacity. The issue as far as the 遊雅堂 オッズflow oven is concerned is how small a temperatu遊雅堂 オッズ diffe遊雅堂 オッズnce can be achieved between component joints. Other concerns add遊雅堂 オッズssed in the development work we遊雅堂 オッズ ba遊雅堂 オッズ-board temperatu遊雅堂 オッズ distribution, temperatu遊雅堂 オッズ profile 遊雅堂 オッズproducibility and obtaining wetting time, and satisfactory 遊雅堂 オッズsults we遊雅堂 オッズ obtained. 遊雅堂 オッズsults we遊雅堂 オッズ especially good in terms of joint-to-joint temperatu遊雅堂 オッズ diffe遊雅堂 オッズnce, which was 遊雅堂 オッズduced to about one-third of the former value.
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