Masakazu Mesaki, Yosh遊雅堂 特徴ori Tatematsu and Hideki Goda
Abstract
Aromatic polyamide-imide resins (PAI) based on Trimellitic anhydride and Diphenylmethane-4,4'-diisocyanete were modified by an oligo-alkoxysilane compound to obtain novel silane-modified PAI. Then, PAI-silica hy遊雅堂 特徴id films were prepared by drying and curing the silane-modified PAI. Increasing the silica unit content gives the hy遊雅堂 特徴id films a higher Young's modulus and a higher tensile strength than the original PAI film, however, maximum elongation is maintained. Furthermore, they have much lower moisture absorption than PAI film under wet conditions. Moreover, this hy遊雅堂 特徴id film has been found to have a different dielectric constant than the conventional film. This report describes properties of silane-modified PAI varnish, which is used as an insulation layer for enameled wire.
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