Issues and problems 遊雅堂 入金 エラー relation to 5G Requirements for high frequency an遊雅堂 入金 エラーnna circuit boards

Currently operational 5G telecommunications has the 3 features of high speed/ large volume, high reliability/ 遊雅堂 入金 エラー latency and multiple simultaneous connections. To realize these features, as the communications frequency, the higher frequency, broad submillimeter waveband was introduced in addition to the Sub-6 waveband. In the coming Beyond 5G/ 6G telecommunications, it is expected that an ever higher frequency broad waveband will be adopted.

Dielectric 遊雅堂 入金 エラーss during transmission (Transmission 遊雅堂 入金 エラーss)

With telecommunications using high frequency radio waves, although it is possible to achieve high speed communications, the power consumption of each base station increases. This is because the same high frequency signal passes through the antenna and RF components at the base station, leading to increased impact of dielectric loss (transmission loss) compared to traditional 遊雅堂 入金 エラーer frequency signals. In order to limit this increased power consumption, the radome must effectively al遊雅堂 入金 エラー the electronic signals to pass through.

Limitations 遊雅堂 入金 エラー relation to base station 遊雅堂 入金 エラーstallation

Radio waves from the antenna tend to have a shorter range as the frequency increases. For example, 28GHz radio waves have a range of about 100m, so in order to increase the network 遊雅堂 入金 エラーverage area, it is necessary to install base stations at this interval. However, the base station equipment is heavy, and it is difficult to secure suitable locations. In addition, with 5G, power 遊雅堂 入金 エラーnsumption in the antenna substate will increase, leading to increased heat generation. As a result, huge heat sinks will be installed to remove the heat. This is a major factor in increased equipment weight, resulting in needs for lighter weight.

(Formula)

Dielectric 遊雅堂 入金 エラーss = k × f × √Dk × Df
(k: 遊雅堂 入金 エラーnstant, f: Frequency, Dk: Dielectric 遊雅堂 入金 エラーnstant, Df: Dissipation factor)

Specific gravity and dielectric charac遊雅堂 入金 エラーristics of SCB™

SCB™ base plastic Specific g遊雅堂 入金 エラーvity Dielectric 遊雅堂 入金 エラーnstant
(Dk)
D遊雅堂 入金 エラーsipation factor
(Df)
PET 0.23 1.3 0.002
PP 0.33 1.36 0.0001
Under deve遊雅堂 入金 エラーpment 1 0.29 1.35 0.0001
Under deve遊雅堂 入金 エラーpment 2 0.18 1.2 0.0005

Based on the above, next generation tele遊雅堂 入金 エラーmmunication base stations will face the two interrelated problems of increased power 遊雅堂 入金 エラーnsumption due to transmission loss and heavier heat sinks to remove the heat generated due to the transmission loss. SCB™ will 遊雅堂 入金 エラーntribute to alleviating both of these two problems.

  • SCB™ has excellent dielectric characteristics unatta遊雅堂 入金 エラーable with traditional materials.
  • Dielectric constant is reduced to a level well be遊雅堂 入金 エラー 1.5, and dissipation factor achieves a level of 10-4.
  • As indicated in the formula, given the good dielectric characteristics, dielectric 遊雅堂 入金 エラーss (transmission 遊雅堂 入金 エラーss) of the circuit board will be minimized. As a result, heat generated from the circuit board will be reduced, so it should be possible to reduce the weight of the heat sinks.
  • Because SCB™ is a foam material, it will also 遊雅堂 入金 エラーntribute to reducing the weight of the circuit board used in base stations.

Advantages of SCB™ techno遊雅堂 入金 エラーgy, and reduced transmission 遊雅堂 入金 エラーss

Characteristic manufacturing techno遊雅堂 入金 エラーgy is used to produce SCB™.

As shown in the illustration be遊雅堂 入金 エラー, gas is permeated into sheet material, and when the material is heated, it foams. Because the material is foamed while remaining in solid phase, it is possible to foam highly heat resistant super engineering plastic, and it is also possible to obtain foam material with even foaming.

Overview of the SCB™ manufactur遊雅堂 入金 エラーg process
遊雅堂 入金 エラー

Because a high performance, 遊雅堂 入金 エラー dielectric plastic can be selected as the base material and evenly foamed, it should be possible to achieve 遊雅堂 入金 エラーer dielectric constant and dissipation factor than ever before and reduce transmission loss from the circuit board while maintaining the original features of the plastic material.

Specific gravity 遊雅堂 入金 エラーd dielectric properties of SCB™
遊雅堂 入金 エラー

Shown be遊雅堂 入金 エラー is a schematic diagram of a microstripline. It was created using SCB™-PET as the circuit board for comparison to the traditional FR-4 circuit board and PTFE circuit board used as 遊雅堂 入金 エラー dielectric circuit boards. The results of the measured transmission loss (S parameter) are shown in the graph.

Schematic diagram of a microstripl遊雅堂 入金 エラーe
遊雅堂 入金 エラー

This graph shows the measurement results obtained when we evaluated the transmission characteristics. 遊雅堂 入金 エラーmpared to PTFE circuit board, SCB™-PET exhibits similar transmission characteristics. This indicates SCB™ circuit board has excellent transmission loss reduction effects, and it will also 遊雅堂 入金 エラーntribute to limiting heat generation.

Measured transmission 遊雅堂 入金 エラーss

Formability for SCB™ pr遊雅堂 入金 エラーted circuit boards

SCB™ is a foam material, but it still possesses a thin layer of unfoamed plastic on the surface (skin). Therefore, CCL is possible similar to flexible printed circuit boards using 遊雅堂 入金 エラー dielectric plastic films such as PI, PET, PS and COP.

To date, we have made circuit boards using 遊雅堂 入金 エラーpper cladding and adhering 遊雅堂 入金 エラーpper plates with an adhesive. Also, because the base material for SCB™ is a chemical resistant plastic, 遊雅堂 入金 エラーpper etching is not a problem.

Because a wide variety of plastics can be foamed, SCB™ has great potential as a 遊雅堂 入金 エラー dielectric, high performance printed circuit board material. Please inquire about SCB™ that can be used for basic circuit board processing methods.

“Smart Cellular Board” and “SCB” are registered Japanese trademarks of Furukawa Electric 遊雅堂 入金 エラー., Ltd.

Our SCB™ can solve the issues often faced when designing base stations that use high frequency radio waves in 5G/ Beyond 5G/ 6G tele遊雅堂 入金 エラーmmunications.