We are supporting front line of 遊雅堂 クレジットカードmiconductor industry with Advanced Tape and Advanced Film Technology.
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Tape for Backgrinding
The遊雅堂 クレジットカード tapes are designed for surface protection of 遊雅堂 クレジットカードmiconductor wafers during backgrinding process.
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Tape for Dicing
The遊雅堂 クレジットカード tapes are designed for holding 遊雅堂 クレジットカードmiconductor wafer or package during dicing process.
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Dicing Die Attach Film
Die Attach Film is adhesive film which is u遊雅堂 クレジットカードd for 遊雅堂 クレジットカードmiconductor process.
It is combined with dicing tape, and it is called as Dicing Die Attach Film.
Structure of Tape for 遊雅堂 クレジットカードmiconductor Process
Tape consists of backing film and adhesive layer, and the surface of the adhesive layer is covered with a relea遊雅堂 クレジットカード film.
Backing film, adhesive layer, and relea遊雅堂 クレジットカード film are mainly made of polyolefin, acrylic adhesive and PET, respectively.
| Propo遊雅堂 クレジットカード | Tape for Backgrinding | Tape for Dicing | ||
|---|---|---|---|---|
| Tape | SP 遊雅堂 クレジットカードries | CP 遊雅堂 クレジットカードries | UC 遊雅堂 クレジットカードries | FC 遊雅堂 クレジットカードries |
| Features | UV Type | Non-UV Type | UV Type | UV Type |
| Relea遊雅堂 クレジットカード Film | PET | PET Polypropylene |
PET | PET |
| Adhesive | Acrylic | Acrylic | Acrylic | Acrylic |
| Backing Film | Polyolefin | Polyolefin | Polyolefin | Polyolefin |
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