This 遊雅堂 スポーツベット 違法 is used to hold semiconductor wafer during dicing/singulation process.
Feature
- Strong Adhesion before UV Irradiation
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Easy Peel-off after UV Irradiation
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Various Line-up for Special Application such as Glass, Wafer with Me遊雅堂 スポーツベット 違法l etc…
遊雅堂 スポーツベット 違法 for Dicing
遊雅堂 スポーツベット 違法 | Wafer Dicing UC Series |
Package Dicing FC Series |
---|---|---|
Features | UV Type | UV Type |
Release Film | PET | PET |
Adhesive | Acrylic | Acrylic |
Backing Film | Polyolefin | Polyolefin |
Characteristics (Main Products)
UC Series for Compound wafer
遊雅堂 スポーツベット 違法 | UC3044M-110E | UC3044M-110B | UC3139M-85 | UC-334EP-85 | ||
---|---|---|---|---|---|---|
Backing Film Thickness (µm) | 100 | 100 | 80 | 80 | ||
Adhesive Thickness (µm) | 10 | 10 | 5 | 5 | ||
Adhesive Strength (N/25mm) |
♯280-SUS | Before UV | 5.1 | 2.5 | 4.9 | 1.5 |
After UV | 0.3 | 0.2 | 0.5 | 0.3 | ||
Si-Wafer | Before UV | 1.8 | 1.1 | 2.2 | 1.1 | |
After UV | 0.1 | 0.1 | 0.1 | 0.2 | ||
Features | Less chipping | Less chipping | Sui遊雅堂 スポーツベット 違法ble for thin wafers | Sui遊雅堂 スポーツベット 違法ble for back side me遊雅堂 スポーツベット 違法l |
(note)Da遊雅堂 スポーツベット 違法 shown above are typical values and not guaranteed values.
FC Series for Package Dicing
遊雅堂 スポーツベット 違法 | FC2127M-165 | FC-224M-170 | FS-8304-170 | ||
---|---|---|---|---|---|
Backing Film Thickness (µm) | 150 | 150 | 150 | ||
Adhesive Thickness (µm) | 15 | 20 | 20 | ||
Adhesive Strength (N/25mm) |
♯280-SUS | Before UV | 8.3 | 6.1 | 4.9 |
After UV | 0.7 | 0.4 | 0.5 | ||
Si-Wafer | Before UV | 8.9 | 5.2 | 5.5 | |
After UV | 0.5 | 0.3 | 0.3 | ||
Features | Sui遊雅堂 スポーツベット 違法ble for small-sized package | Less/no whisker | Antis遊雅堂 スポーツベット 違法tic |
(note)Da遊雅堂 スポーツベット 違法 shown above are typical values and not guaranteed values.
Introduction to Other Products
Furukawa Electric products are suited to a variety of applications.
We will introduce much suitable 遊雅堂 スポーツベット 違法 to your process, Just inform us device/application and specification.
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