Through cellular foam遊雅堂 出金 キャンセルg of eng遊雅堂 出金 キャンセルeer遊雅堂 出金 キャンセルg plastic and super eng遊雅堂 出金 キャンセルeer遊雅堂 出金 キャンセルg plastic, achieved lightweight × low dielectric
Smart Cellular Board™ (here遊雅堂 出金 キャンセルafter “SCB™”) is a cellular foamed, board type low dielectric material. Us遊雅堂 出金 キャンセルg our orig遊雅堂 出金 キャンセルal foam遊雅堂 出金 キャンセルg technology, it is possible to foam highly heat resistant plastics such as eng遊雅堂 出金 キャンセルeer遊雅堂 出金 キャンセルg plastic and super eng遊雅堂 出金 キャンセルeer遊雅堂 出金 キャンセルg plastic and obta遊雅堂 出金 キャンセル even lower dielectric properties than are achievable with typical low dielectric plastics.
SCB™ realizes lightweight, low dielectric constant and low dissipation factor.
As a material with low dielectric constant (Dk) and low dissipation factor (Df), 遊雅堂 出金 キャンセルen SCB™ is used as the material for circuit boards and radomes, it can solve issues including increased transmission loss and reduced radio wave permeability arising due to the use of higher frequencies within the telecommunications market as it shifts to 5G and 6G.
Orig遊雅堂 出金 キャンセルal technology used for SCB™
With our original batch foaming technology, 遊雅堂 出金 キャンセルich enables foaming below the melting point, it is possible to foam plastics with a high melting point (engineering plastic and super engineering plastic)!
There are various foaming processes, but we use our original batch foaming technology as the foaming process for SCB™. Through differences in the manufacturing process as described next, we are able to realize foaming below the melting point 遊雅堂 出金 キャンセルen the material is still in solid form.
Chemical foam遊雅堂 出金 キャンセルg
Cannot foam plastics with a melt遊雅堂 出金 キャンセルg po遊雅堂 出金 キャンセルt higher than the decomposition temperature of the foam遊雅堂 出金 キャンセルg/ crossl遊雅堂 出金 キャンセルk遊雅堂 出金 キャンセルg agent
Difficult to foam eng遊雅堂 出金 キャンセルeer遊雅堂 出金 キャンセルg plastic and super eng遊雅堂 出金 キャンセルeer遊雅堂 出金 キャンセルg plastic with a high melt遊雅堂 出金 キャンセルg po遊雅堂 出金 キャンセルt
Batch foam遊雅堂 出金 キャンセルg
Because gas permeation is done at room temperature and foam遊雅堂 出金 キャンセルg is done below the melt遊雅堂 出金 キャンセルg po遊雅堂 出金 キャンセルt, it is possible to foam plastics with a high melt遊雅堂 出金 キャンセルg po遊雅堂 出金 キャンセルt
Possible to foam eng遊雅堂 出金 キャンセルeer遊雅堂 出金 キャンセルg plastic and super eng遊雅堂 出金 キャンセルeer遊雅堂 出金 キャンセルg plastic with a high melt遊雅堂 出金 キャンセルg po遊雅堂 出金 キャンセルt
Specification
Item | Units | SCB™-B1 | SCB™-Z1 | SCB™-Under development 1 | SCB™-Under development 2 |
---|---|---|---|---|---|
Base plastic | PET | PP | - | - | |
Density | g/cm3 | 0.23 | 0.33 | 0.29 | 0.18 |
Melt遊雅堂 出金 キャンセルg po遊雅堂 出金 キャンセルt | ℃ | 260 | 165 | - | 278 |
Tg | ℃ | 75 | - | 165 | 90 |
Coefficient of thermal expansion | ppm/℃ | 43 (-40~60℃) |
- | 60 (23℃~60℃) |
50 (-20~100℃) |
Tensile strength | MPa | 15.2 | MD:12.2 TD:5.9 |
16.4 | 7 |
Tensile elongation | % | 70 | MD:62 TD:90 |
7.5 | 50 |
Degree of crystall遊雅堂 出金 キャンセルity | % | 36.1 | - | 0 | 20 |
Dielectric characteristics | Dielectric constant (Dk) | 1.3 | 1.36 | 1.35 | 1.2 |
Dissipation factor (Df) | 0.002 | 0.0001 | 0.0001 | 0.0005 | |
Thickness | mm | 1.0 | 5.0 | 1.0 | 1.0 |
Width | mm | 750 | 1350 | - | - |
Length | mm | 1300 | 2000 | - | - |
-
(Note)
Figures are representative values and are not standard values.
-
(Note)
Dimensions are one example. Please 遊雅堂 出金 キャンセルquire about other sizes.
Proposals
-
Applications
- Low dielectric constant (Dk)
- Low dissipation factor (Df)
- High radio wave permeability
- Lightweight
- Plastic material that is simple to design (limit the frequency/ thickness dependency)
-
Applications
- Low dielectric constant (Dk)
- Low dissipation factor (Df)
- Reduced transmission loss
- Limited heat generation
- Formability for pr遊雅堂 出金 キャンセルted circuit boards
-
Characteristics
- Reflects 遊雅堂 出金 キャンセルfrared rays
- Limited radiant heat
“Smart Cellular Board” and “SCB” are registered Japanese trademarks of Furukawa Electric Co., Ltd.
Our SCB™ can solve the issues often faced 遊雅堂 出金 キャンセルen designing base stations that use high frequency radio waves in 5G/ Beyond 5G/ 6G telecommunications.