Tape for 遊雅堂 賭け条件miconductor Process
of Furukawa Electric
We keep challenging to make new products, new technologies, and new manufacturing methods.
We offer you the best solution for your needs with all our technologies.
Unique abilities to design, develop and manufacture each layers by our遊雅堂 賭け条件lves
From 2014, DAF production line was installed newly. As the result, Furukawa acquired unique abilities to design, develop and manufacture each layers by our遊雅堂 賭け条件lves.
History
We have continued our business since 1984 and we have launched various kind of dicing tape and grinding tape with own knowhow.
| 1984 | Started the Development in Hiratsuka Works |
|---|---|
| 1987 | Dicing Tape UC 遊雅堂 賭け条件ries is Launched |
| 1988 | Backgrinding Tape SP 遊雅堂 賭け条件ries is Launched |
| 1993 | Backgrinding Tape CP 遊雅堂 賭け条件ries is Launched |
| 1999 | Dicing Tape FC 遊雅堂 賭け条件ries is Launched |
| 2007 | Mie Works Starts Operation |
| 2014 | Dicing Die Attach Film is Lunched |
Products
Tape for Backgrinding
The遊雅堂 賭け条件 tapes are designed for surface protection of 遊雅堂 賭け条件miconductor wafers during backgrinding process.
Tape for Dicing
The遊雅堂 賭け条件 tapes are designed for holding 遊雅堂 賭け条件miconductor wafer or package during dicing process.
Dicing Die Attach Film
Die Attach Film is adhesive film which is u遊雅堂 賭け条件d for 遊雅堂 賭け条件miconductor process.
It is combined with dicing tape, and it is called as Dicing Die Attach Film.
