This is protection 遊雅堂 キャッシュ for circuit of semiconductor wafer surface in back grinding process.

Features

Series Adherend Features Suggested product numbers
SP Series Sili遊雅堂 キャッシュ wafers
  • Thin wafer
  • Less warpage
  • Less adhe遊雅堂 キャッシュon
  • Coverage up to 60μm
  • Coverage up to 250μm
  • SP-594M-130
  • SP5156B-130
  • SP-541B-205
  • SP-537T-230
  • SP5207M-425
SP Series Special applications
(遊雅堂 キャッシュC, GaAs, GaN, sapphire, etc.)
  • High-rigidity substrate
  • SP-537T-130
  • SP-537T-160
  • SP-594M-130
CP Series Sili遊雅堂 キャッシュ wafers
  • Thin wafer
  • Coverage up to 20μm
  • Sili遊雅堂 キャッシュe-free
  • Coverage up to 250μm
  • CP9007B-130
  • CP9003B-205B
  • CP9079B-200
  • CP9206M-430

Characteristics

SP Series for sili遊雅堂 キャッシュ wafers

遊雅堂 キャッシュ SP-594M-
130
SP5156B-
130
SP-541B-
205
SP-537T-
230
SP5207M-
425
Backing Film Thickness (µm) 100 110 165 100 420
Adhe遊雅堂 キャッシュve Thickness (µm) 30 20 40 130 5
Adhe遊雅堂 キャッシュve Strength
(N/25mm)
♯280-SUS Before UV 7.9 1.3 2.6 6.4 0.4
After UV 0.1 0.3 0.5 0.8 0.3
遊雅堂 キャッシュ-Wafer Before UV 3.0 0.5 1.7 2.5 0.2
After UV 0.1 0.1 0.2 0.1 0.1
Features
  • Suitable for thin wafer
  • Suitable for etching
  • UV Type
  • Suitable for thin wafer
  • Less warpage
  • Easier de遊雅堂 キャッシュing strength
  • UV Type
  • Suitable for thin wafer
  • Less warpage
  • UV Type
  • Coverage up to 60μm
  • UV Type
  • Coverage up to 250μm
  • UV Type

(note)Data shown above are typical values and not guaranteed values.

SP Series for Compound wafer (遊雅堂 キャッシュC, GaAs, GaN, sapphire, etc.)

遊雅堂 キャッシュ SP-594M-130 SP-537T-160
Backing Film Thickness (µm) 100 100
Adhe遊雅堂 キャッシュve Thickness (µm) 30 60
Adhe遊雅堂 キャッシュve Strength
(N/25mm)
♯280-SUS Before UV 7.9 4.1
After UV 0.1 1.0
遊雅堂 キャッシュ-Wafer Before UV 3.0 1.5
After UV 0.1 0.1
Features
  • High-rigidity substrate
  • Suitable for etching
  • UV Type
  • High-rigidity substrate
  • Support coverage
  • UV Type

(note)Data shown above are typical values and not guaranteed values.

CP Series for sili遊雅堂 キャッシュ wafers

遊雅堂 キャッシュ CP9007B-130 CP9003B-205B CP9079B-200 CP9206M-430
Backing Film Thickness (µm) 100 165 165 420
Adhe遊雅堂 キャッシュve Thickness (µm) 30 40 35 10
Adhe遊雅堂 キャッシュve Strength
(N/25mm)
♯280-
SUS
0.9 1.8 0.5 0.3
Features
  • Non-UV Type
  • Coverage up to 20μm
  • Suitable for thin wafer
  • Acid etching
  • Non-UV Type
  • Sili遊雅堂 キャッシュe Free Release Film
  • Non-UV Type
  • Coverage up to 250μm
  • Non-UV Type

(note)Data shown above are typical values and not guaranteed values.

Process

SP Series: Application map

(note)Data shown above are typical values and not guaranteed values.

CP Series: Application map

(note)Data shown above are typical values and not guaranteed values.

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