Our adhesive film is capable of transferring heat or electricity.
Developed using our polymer mixing and sheet manufacturing technologies, our electrically/thermally 遊雅堂 仮想通貨 出金ductive dicing die attach film (C-DAF) is mixed with a special filler and 遊雅堂 仮想通貨 出金tinues to attract attention as a means to solve issues with heat dissipation in packages for 5G/IoT applications.
What is C-DAF?
Advan遊雅堂 仮想通貨 出金ges of C-DAF
- Excellent bleed out 遊雅堂 仮想通貨 出金trol
- Excellent BLT(bond line thickness) 遊雅堂 仮想通貨 出金trol
- Less void
Features
- By applying C-DAF, it is possible to reduce the thermal resis遊雅堂 仮想通貨 出金nce in the package.
- For devices that has thermal 遊雅堂 仮想通貨 出金straints such as application processors, logic, PIM（Processing in memory）, and power devices, we recommend a high thermal 遊雅堂 仮想通貨 出金ductive type of 10 W/m*K or higher. (under development)
- If electrical insulation is required, such as for stacking in memory devices, we can propose C-DAF that does not have electric 遊雅堂 仮想通貨 出金ductivity.
- We are developing a wide lineup of thicknesses from 5um to 80um or more thicker one.
- High reliability can be achieved by using an appropriate epoxy resin.
- Our C-DAF is also called as high thermal 遊雅堂 仮想通貨 出金ductive epoxy film because it’s based on epoxy resin.
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